Sponsor

Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp

Sponsor

vCONNECT: Your Next Level of Digital Connectivity
Discover vCONNECT: Analyze inspection data, monitor machine performance, predict maintenance needs, store data securely and access AI tools and the latest Viscom News.
Viscom SE

Ask the Experts

July 30, 2007 - Updated
July 29, 2007 - Originally Posted

Scribe lines for depaneling boards

Is there any standard or recommended specification used by board manufacturers for the depth of the scribe lines used to depanel boards? Appreciate your insight.

Brian Wall

Expert Panel Responses

The specifications tend to be based on the web thickness (board remaining) rather then the depth of the scribe lines. I good place to go is Vscore Central.

Dr. Craig D. Hillman
CEO & Managing Partner
DfR Solutions

Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.

The document you are looking for is IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Page 14 Fig 5-2 Provides all the information you will need to determine the Scoring parameters for depaneling the boards.

Leo Lambert
Vice President, Technical Director
EPTAC Corporation

At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.

A 30% score depth on each side should work. Pay attention to alignment of the two "V" cuts.

Prashant Joshi
Director of Engineering
Interconnect Systems Inc.

Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.

Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas