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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process  especially those with vacuum  is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD

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3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Ask the Experts Member

Prashant Joshi

Director of Engineering

Interconnect Systems Inc.

Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.

Prashant Joshi has submitted responses to the following questions.

Is Pre-Bake Standard for Rework?
I would recommend IPC/JEDEC J-STD-033B which is a specification for handling, packing, shipping and use of moisture/reflow sensitive surface mount ...

Scribe lines for depaneling boards
A 30% score depth on each side should work. Pay attention to alignment of the two "V" cuts.

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Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

TLPS is proven for outstanding reliabiility #1