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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE
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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering
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Ask the Experts Member |
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Prashant Joshi
Director of Engineering
Interconnect Systems Inc.
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Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.
Prashant Joshi has submitted responses to the following questions.
Pre-Bake Standard for Rework
I would recommend IPC/JEDEC J-STD-033B which is a specification for handling, packing, shipping and use of moisture/reflow sensitive surface mount ...
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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated
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