| Sponsor |
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
| Sponsor |
|
Storage Solutions – Free Online Demo
Our online demos give our clients a deep insight into our solutions, allowing them to interact with an expert and have their questions answered throughout. Discover our technology wherever you are.
Essegi Automation
|
|
Ask the Experts Member |
|
|
Prashant Joshi
Director of Engineering
Interconnect Systems Inc.
|
Prashant has 15 years experience in design and process development. With a MS in Mechanical/ Materials Engineering his areas of interest are connectors, electronics assembly, SMT, reballing, wire bond.
Prashant Joshi has submitted responses to the following questions.
Pre-Bake Standard for Rework
I would recommend IPC/JEDEC J-STD-033B which is a specification for handling, packing, shipping and use of moisture/reflow sensitive surface mount ...
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Reinforce Critical Components on PCBs
Low modulus wire tacking & ruggedizing adhesives hold vital BGAs & VGAs in place, enhancing shock & vibration resistance of electronic assemblies.
Dymax
|
|
|
