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October 2, 2006

BGA Rework and Repair

How many times can a BGA device be reworked and run through reflow oven process?


Experts Comments

Consider that J-STD-033B limits a component to just one 125 degree C 96-hour bake cycle.

The manufacturer baked it for 48-hours at dry--you would be baking for the remaining 48-hours. If the package exceeds its factory-floor-life again, it can't be baked so it's scrap.

Charles S. Leech Jr.
Director of Engineering
Innovative Drying Co.
Mr. Leech lead a successful 2 year long process development effort that identified the parameters required to rapidly dry moisture sensitive devices while they were encased in the tape and reel format. Mr. Leech has over thirty years of experience as a manufacturing engineering manager in the electronics industry.
NOTE: Mr. Leech is no longer working at Innovative Drying Co.

Thank you for the question.

My belief is in rework you try and replicate the original production process...as much as possible. Therefore, it is best to only solder a component once. If you desolder...then reball + resolder...the component has now been through at least 3 reflows and possible increased component degradation will have occured. 

However, life is not perfect and sometimes with no new components available, you may have to re-use an old device. As long as tight temperature controls are always used, you should be ok to re-use a component, once. Beyond this, I feel you are asking for trouble and may get field failures later on.

Roger Gibbs
Managing Director
Twenty years ago Mr. Gibbs, Managing Director of PDR, produced the first rework system based on Focused Infra-Red light energy. PDR now has a 3,500-strong global installation list with top OEMs and EMS providers.
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