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Charles S. Leech Jr.


Director of Engineering
Innovative Drying Co.

Mr. Leech lead a successful 2 year long process development effort that identified the parameters required to rapidly dry moisture sensitive devices while they were encased in the tape and reel format. Mr. Leech has over thirty years of experience as a manufacturing engineering manager in the electronics industry.
NOTE: Mr. Leech is no longer working at Innovative Drying Co.

Charles S. Leech Jr. has submitted responses to the following questions.
Bake Tape and Reel Components
I am assuming that you are using common commercial tapes and reels. These can not withstand the commonly used 125 ...
Bake for Repair
Unfortunately, there isn't a simple answer to your question. Let's take a detailed view of your inquiry.We will assume that ...
Baking lead-free and lead PCB's before assembly
You haven't given the reason for the required baking process, so I'll give you the "Lessons Learned" from our three-year ...
Proper method to bake PCB's
You haven't given the reason for the required baking process, so I'll give you the "Lessons Learned" from our three-year ...
BGA Rework and Repair
Consider that J-STD-033B limits a component to just one 125 degree C - 96-hour bake cycle. The manufacturer baked it ...
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Zestron

Defluxing Ultra-Fine Pitch CoW Devices? Read This.
DI water falls short on copper pillar packages. Get proven cleaning parameters for CoW devices with <25μm pitch in our white paper.
ZESTRON Americas
Uyemura