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Board Level Reliability Testing of RF Packages
The paper presents a summary of board level reliability test performed on RF packages, the assembly process, mechanical and environmental tests, and understanding failures.
Technical Paper
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Authored By:
Mumtaz Y. Bora
pSemi
CA, USA
Summary
Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a supplier, this must be accompanied with board level reliability data to ensure assembly and field reliability. The paper presents a summary of board level reliability test performed on RF packages, the assembly process controls and monitoring, mechanical and environmental reliability tests, understanding of failure modes and lessons learned.
Conclusions
Board level reliability tests can be done successfully with proper planning and execution of process, materials, and equipment controls. BLRT is a customized test, so understanding of package geometry, board interactions, material properties and test conditions can provide reliable results. As semiconductor packages diversify and advanced packages increase in complexity, the stresses they experience become more complex. A good understanding of the use environment, customer expectations and accurate testing can provide success in field reliability.
Initially Published in the SMTA Proceedings
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