Sponsor

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS

Sponsor

Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation

Ask the Experts Member

Jon Urquhart

Director of Applications Engineering

Precision Value & Automation (PVA)

Jon Urquhart is a renowned expert in the application of conformal coating materials with over 30 years of applicable experience, specializing in the processing of fluid materials. He holds multiple patents for spray and dispense valve designs, including machine configurations.

Jon Urquhart has submitted responses to the following questions.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Reflow Soldering Oven Survey
We invite you to participate in this important survey about Reflow Soldering Ovens. This survey is anonymous, and your personal data is not collected. Click to begin survey.
Circuitnet Media LLC

Trusted Partner for Mission-Critical PCBs