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Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Plasma-Etch
Sponsor
Circuit-Technology-Center

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
Circuit Technology Center

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Jon Urquhart


Director of Applications Engineering
Precision Value & Automation (PVA)

Jon Urquhart is a renowned expert in the application of conformal coating materials with over 30 years of applicable experience, specializing in the processing of fluid materials. He holds multiple patents for spray and dispense valve designs, including machine configurations.

Jon Urquhart has submitted responses to the following questions.
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Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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