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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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John Kinnear
Sr. Technical Manager
ESD Associaiton
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John is the Senior Technical Manager for the ESD Association. He was previously the subject matter expert for IBM in ESD control for over 30 years. John is the chair of the ESD Association's Working Group 20, which writes ANSI/ESD S20.20 - ESD Process Control, and the chair of IEC TC 101 - Electrostatics.
John Kinnear has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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