Sponsor

Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
Master Bond

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Reflow Oven and Wave Soldering Machine Maintenance Cleaning
Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
KYZEN

Ask the Experts Member

John Kinnear

Sr. Technical Manager

ESD Associaiton

John is the Senior Technical Manager for the ESD Association. He was previously the subject matter expert for IBM in ESD control for over 30 years. John is the chair of the ESD Association's Working Group 20, which writes ANSI/ESD S20.20 - ESD Process Control, and the chair of IEC TC 101 - Electrostatics.

John Kinnear has submitted responses to the following questions.

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Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

The Essential Guide for High-Reliability BGA Component Re-balling