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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Gayle Towell
Content Marketing Specialist
AIM Solder
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Gayle Towell has completed AIM Solder's Technical Sales and Solder Application training and holds master's degrees in both mathematics and physics from the University of Oregon. She has nearly two decades of experience communicating complex technical subject matter to a wide variety of audiences.
Gayle Towell has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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