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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Gayle Towell
Content Marketing Specialist
AIM Solder
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Gayle Towell has completed AIM Solder's Technical Sales and Solder Application training and holds master's degrees in both mathematics and physics from the University of Oregon. She has nearly two decades of experience communicating complex technical subject matter to a wide variety of audiences.
Gayle Towell has submitted responses to the following questions.
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