Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist. Master Bond
Saturn Electronics Corporation / Saturn Flex Systems
With almost thirty years of experience in the bare printed circuit board industry, Yash Sutariya holds Management positions at both Saturn Electronics Corporation and Saturn Flex Systems.
Yash Sutariya has submitted responses to the following questions.
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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH
