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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Precision Control for BGA Rework
Vacuum sensing electronics provide control for gentle, automatic component removal while a non-contact site cleaning tip's height is accurately monitored and maintained.
Air-Vac Engineering
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Ask the Experts Member |
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Petr Stejskal
Solder Joint and PCB Research Analyst
Independent Consultant
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Petr Stejskal is independent consultant and certified IPC-A-610 trainer. He has small lab for making solder joints and PCBs cross sections and evaluation.
Petr Stejskal has submitted responses to the following questions.
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