Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist. Master Bond
Petr Stejskal is independent consultant and certified IPC-A-610 trainer. He has small lab for making solder joints and PCBs cross sections and evaluation.
Petr Stejskal has submitted responses to the following questions.
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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH
