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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Steve Hrycko
Head of Manufacturing
Arc-Tronics
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Steve Hrycko is an engineer with over 33 years of experience in electronics and micro-electronics manufacturing serving the military aerospace, medical and industrial markets. He has worked in various engineering development and manufacturing roles in Europe, Asia and the United States.
Steve Hrycko has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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