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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Mike Korte
Technical Manager
SEHO North America
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Mike Korte joined SEHO North America as Service Engineer in 2009 and was promoted to the position of Technical Manager in 2013. His outstanding experience covers both excellent machine knowledge and process know-how.
Mike Korte has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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