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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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Christian Vega
Global Sales Manager & Applications Manager
GPD Global
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Christian Vega has been in the dispensing industry since 1993. He was immersed in product, applications and also business development. Christian's expertise is applications across the Dispensing Industry from Surface Mount to Semiconductor.
Christian Vega has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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