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Uyemura

Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Plasma-Etch
Sponsor
Circuit-Technology-Center

Safely Remove Underfilled BGAs Without Damaging the Circuit Board
Learn how cold precision milling techniques enable the removal of underfilled BGAs while minimizing risk to components, circuit traces, and board integrity.
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Daniel Sinclair


National Sales Manager
MicroCare Corporation

MicroCare makes a promise to every one of our customers, and that promise is this: We will do everything we can to deliver to your hands the very best value in critical cleaning. We will strive to help you clean better, faster, safer and more economically. That means we will work hard to get you the right chemistry, the right process, and the right training so you get the critical cleaning results you need. Our promise is backed by our line of innovative products and our team of world class chemical experts.

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Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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