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Vapor Phase Profiling
Thermal profiling the vapor phase soldering process – especially those with vacuum – is challenging. ECD's M-VP™ sealed barrier can take it. Learn more.
ECD
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Ask the Experts Member |
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Fabrice Caillet
Process Engineer
Neopost Industrie
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Process engineer since 2002 in electronics assembly, responsible for industrialization of new pcbas, process definition and monitoring, instruction worksheets and change management.
Fabrice Caillet has submitted responses to the following questions.
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