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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Maintenance cleaning is imperative. Investment in a cleaning schedule and chemistry creates reliable processes to extend equipment life.
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David Lober

David Lober

Process Chemist
Kyzen Corporation
Mr. Lober, Process Chemist at Kyzen, holds a B.S. degree in Chemistry from the Rensselaer Polytechnic Institute. He is an active researcher into the effects of various cleaning agents, analytical test methods, analytical testing, and controlling cleaning agents as well as being in charge of the Ion Chromatography analysis at Kyzen. David is also a very active member of the IPC and SMTA and has quickly become an industry authority on the design of electronic assembly cleaning materials and process integration.

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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling