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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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Ask the Experts Member |
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David Lober
Process Chemist
Kyzen Corporation
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Mr. Lober, Process Chemist at Kyzen, holds a B.S. degree in Chemistry from the Rensselaer Polytechnic Institute. He is an active researcher into the effects of various cleaning agents, analytical test methods, analytical testing, and controlling cleaning agents as well as being in charge of the Ion Chromatography analysis at Kyzen. David is also a very active member of the IPC and SMTA and has quickly become an industry authority on the design of electronic assembly cleaning materials and process integration.
David Lober has submitted responses to the following questions.
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AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
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