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Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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Karl Manske

Karl Manske

Senior Technical Service Chemist
3M Company, Electronics Markets Materials Division
Expertise in the field of fluorinated materials chemistry: Coatings for Moisture and Corrosion Protection, Fluids for Precision Cleaning, Material Selection, Test Method Development, New Application Development, New Product Introduction Specialties: Synthesis, formulation and application of fluorinated polymers for use as surface modifiers and specialty coatings. Use and application of fluorinated fluids for precision cleaning and other high value applications.

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Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
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The Essential Guide for High-Reliability BGA Component Re-balling