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High-Reliability for Low-Temp Processes
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Ask the Experts Member |
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Joe Karcewski
Product Manager
APS-Novastar, LLC
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Joe Karcewski has been a Process Engineer for 16 years in the industry. He is a certified IPC-A-610 trainer and is presently working at APS-Novastar as a Product Manager for Soldering Systems including Selective Soldering systems.
Joe Karcewski has submitted responses to the following questions.
Pin-in-Paste Hole Fill
To ensure proper plated hole fill during the screen printing process you must have the proper volume of solder paste. ...
Is PCB Baking Necessary?
This is a correct statement. PCB Baking is not necessary if the PCB is Vacuum Packed by the PCB Supplier ...
Recommended Rework Dwell Times
When hand soldering utilizing Sn/Pb solder, the maximum dwell time at any thru-hole lead should be 20 seconds. A much ...
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