circuitnet
Sponsor
Test-Research-Inc.

AI Void Detection - X-Ray Inspection
X-ray Inspection for hidden and buried solder joints. BGA, QFN, THT, and more. High Speed and High Resolution configurations available.
Test Research, Inc.
SEIKA-America
Sponsor
Dymax

Adhesives for Tomorrow's Electronics
Dymax UV/LED curable adhesives, dispensers & curing equipment provide bonding and protection solutions for PCBs and board-level components. Learn how!
Dymax

Ask the Experts Member

INDEX
ASK
PANEL
JOIN
image

Joe Karcewski


Product Manager
APS-Novastar, LLC

Joe Karcewski has been a Process Engineer for 16 years in the industry. He is a certified IPC-A-610 trainer and is presently working at APS-Novastar as a Product Manager for Soldering Systems including Selective Soldering systems.

Joe Karcewski has submitted responses to the following questions.
Pin-in-Paste Hole Fill
To ensure proper plated hole fill during the screen printing process you must have the proper volume of solder paste. ...
Is PCB Baking Necessary?
This is a correct statement. PCB Baking is not necessary if the PCB is Vacuum Packed by the PCB Supplier ...
Recommended Rework Dwell Times
When hand soldering utilizing Sn/Pb solder, the maximum dwell time at any thru-hole lead should be 20 seconds. A much ...
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
BEST-Inc.

Unlock the Potential of Salvaged Devices
Component harvesting is a reliable method of electronic component reclamation, reducing e-waste and ensuring economic reuse for automated assembly.
BEST Inc.
Plasmatreat-GmbH