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Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch

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Tech Paper - The Economics of Electronic Component Salvage and Reuse
This paper examines the economic and environmental benefits of salvaging and reusing high-value electronic components.
Circuit Technology Center

Ask the Experts Member

Joe Karcewski

Product Manager
APS-Novastar, LLC

Joe Karcewski has been a Process Engineer for 16 years in the industry. He is a certified IPC-A-610 trainer and is presently working at APS-Novastar as a Product Manager for Soldering Systems including Selective Soldering systems.

Joe Karcewski has submitted responses to the following questions.

Pin-in-Paste Hole Fill
To ensure proper plated hole fill during the screen printing process you must have the proper volume of solder paste. ...

Is PCB Baking Necessary?
This is a correct statement. PCB Baking is not necessary if the PCB is Vacuum Packed by the PCB Supplier ...

Recommended Rework Dwell Times
When hand soldering utilizing Sn/Pb solder, the maximum dwell time at any thru-hole lead should be 20 seconds. A much ...

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Introducing our new Board to Board Connectors
These new Board to Board Connectors feature pitch sizes from 0.50 mm to 1.00 mm with multi-pitch and custom pitch designs available. Designed for long-life applications and robust handling.
Advanced Interconnections Corp