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Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.
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Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron
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Ask the Experts Member |
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Sam Burton
President
Tropical PCB Design Services Inc.
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With 28+ years of direct PCB layout and design experience and 8 years as President of Tropical Design; Mr. Burton has the breadth and depth of knowledge to assist in solving most design and manufacturing related issues.
Sam Burton has submitted responses to the following questions.
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