Sponsor

Vapor Phase Profiling
Thermal profiling the vapor phase soldering process  especially those with vacuum  is challenging. ECD's M-VP sealed barrier can take it. Learn more.
ECD

Sponsor

3 Ways to Increase Plasma Uniformity
Process temperature is the most important parameter in the plasma process. Process temperature has primary control over etch rate and has a secondary effect on etch uniformity. Read more.
Plasma Etch

Ask the Experts Member

Doug Farlow

President

Production Solutions, Inc.

Mr. Farlow is President at Production Solutions Ins. where they manufacturer the Red-E-Set family of board support systems. His expertise is board support solutions for screen printers, pick and place machines, chipshooters, dispensers and AOI machines.

Doug Farlow has submitted responses to the following questions.

Component Shifting
One possible cause could be board support related. If the board is not being supported properly the board will experience ...

BGA re-balling process
A great source for solder spheres for re-balling is East Spheres.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Removal/Milling of Underfilled Parts: AVX1000M
High precision milling with zero adjacent clearance. Auto laser height measurement of board and component. Learn more.
Air-Vac Engineering

TLPS is proven for outstanding reliabiility #1