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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
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Need Improved Solder Joint Visibility?
Solder Peel-A-Way° Removable Terminal Carriers in place and peel the carrier away for complete solder joint visibility on both sides of the PCB. Watch a video to see it in action.
Advanced Interconnections Corp.
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Ask the Experts Member |
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Doug Farlow
President
Production Solutions, Inc.
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Mr. Farlow is President at Production Solutions Ins. where they manufacturer the Red-E-Set family of board support systems. His expertise is board support solutions for screen printers, pick and place machines, chipshooters, dispensers and AOI machines.
Doug Farlow has submitted responses to the following questions.
Component Shifting
One possible cause could be board support related. If the board is not being supported properly the board will experience ...
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Catch Defects Before They Cost You
3D AOI analyzes true solder height, contour, and volume to expose defects 2D systems miss—reducing false calls, rework, and escapes on ultra-compact components.
Manncorp Inc.
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