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High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability, and reduces energy use up to 15%.
Indium Corporation
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Low Outgassing, Silver Filled Silicone
Master Bond MasterSil 323S-LO is an electrically and thermally conductive, addition cured adhesive designed for bonding applications where low stress is critical.
Master Bond
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Ask the Experts Member |
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Stuart Erickson
President
Ultrasonic Systems, Inc.
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Mr. Erickson is co-founder of Ultrasonic Systems, Inc. a technology leader in ultrasonic spray technology. Hi is holder of several patents related to ultrasonic spray technology. His roles include product development, technology application, sales and marketing.
Stuart Erickson has submitted responses to the following questions.
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