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AIT ORMET® TLPS for Component Attach
AIT ORMET®TLPS is proven for outstanding reliability for component attaches and MLCC build-up for high temperature applications beyond 175ÂșC
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Stuart Erickson
President
Ultrasonic Systems, Inc.
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Mr. Erickson is co-founder of Ultrasonic Systems, Inc. a technology leader in ultrasonic spray technology. Hi is holder of several patents related to ultrasonic spray technology. His roles include product development, technology application, sales and marketing.
Stuart Erickson has submitted responses to the following questions.
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Thermally Conductive, Low Outgassing Epoxy
Master Bond EP21AOLV-2LO is an electrically insulating adhesive that meets NASA low outgassing requirements for sealing, coating and encapsulation applications. Ask an expert.
Master Bond
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