Sponsor

Copper Stud & CTE Nano Tech Underfill
AIT's proven flip-chip and BGA multi-level underfills offer both 18 ppm/°C copper CTE matching fine-pitch & nano-pitch with 10 µm & 0.3 µm respective cut-off particles.
AI Technology, Inc.

Sponsor

Inline Automatic X-Ray Inspection: TruView™ Verus
TruView™ Verus is a high-resolution inline AXI system offering advanced 2D, 2.5D, and 3D imaging to detect defects in electronic assemblies with exceptional accuracy and speed.
Creative Electron

Ask the Experts Member

Craig Hood

Director of Intl Sales and Global Marketing
Petroferm Inc.

Mr. Hood is Director of International Sales and Global Marketing for Petroferm's Cleaning Products Division, a manufacturer and supplier of cleaning agents for defluxing and stencil cleaning.
NOTE: Mr. Hood is no longer working at Petroferm Inc.

Craig Hood has submitted responses to the following questions.

Cleaning methodology and options
I would recommend you evaluate a vapor degreasing process, either mono-solvent or co-solvent. There is a good chance you have ...

Lead frame contamination
I'm not sure what methods you or others use now to determine incoming cleanliness other than visual and yield loss. ...

PCB Cleaning
Improve cleaning? Not necessarily. Is it a good idea? In general, yes. Reducing the amount of gross contamination (raw solder ...

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Sponsor

Capital Expenses Significantly Reduced by Eliminating Dispensed Adhesives and Underfills
Learn how you can potentially save $300K-$900K in capital expense with our PLACE-N-BOND Underfilms. Click here.
Alltemated Inc.