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iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom SE

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Cold Underfill Component Removal
A significant Rework challenge is reworking where there is minimal or zero clearance between adjacent parts near an underfilled area array device. A precision milling machine makes this possible.
Air-Vac Engineering

Ask the Experts Member

Scott D. Szymanski

Global Marketing Manager
Nordson MARCH

Mr. Szymanski works to expand strategic alliances, strengthen partnerships with equipment suppliers, and develop future product offerings tailored to the semiconductor market.
NOTE: Mr. Szymanski is no longer working at Nordson MARCH

Scott D. Szymanski has submitted responses to the following questions.

BGA Component Moisture Exposure
Instead of using heat (a known enemy of electronics) in an attempt to drive off moisture, it may be more ...

Gold Plated Lead Discoloration
It appears gold (Au) from the leads is diffusing into the solder and forming a solder-gold intermetallic compound (IMC), which ...

Problems with Bubbles in Conformal Coating
It sounds like you're getting poor initial surface wettability between the circuit card and your low VOC silicone compound when ...

When Should We Use Underfill?
Wafer Level Packages (WLPs) should always be plasma treated (in order to improve underfill bonding, fluid flow and adhesion performance), ...

Epoxy Bonding Problems on RoHS Boards
Even if the boards look clean, you should do a Control test to investigate the surface energy of the boards ...

Black Pad Investigation
The black pads are due to nickel corrosion & oxidation during the gold (Au) deposition step. This is a common ...

Delamination dilemma
Delamination, unfortunately, is a fairly common problem for modern circuit boards, especially high-density, multi-layer boards or those composed of advanced ...

Conformal Coating & Humidity
If condensation due to high humidity is penetrating at only the interface(s) of your conformal coating and the board, you ...

Oxidation on Immersion Silver PCB's
To remove oxidation or other contamination from the surface of your Immersion Silver finish, try using a low-pressure gas plasma ...

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IC Programming: Memory & Logic Devices
Full support of all package types. Support for all major semiconductor manufacturers. Full dry-pack capabilities to support moisture sensitive products.
Alltemated