Scott D. Szymanski

Scott D. Szymanski has submitted responses to the following questions.

BGA Component Moisture Exposure
Instead of using heat (a known enemy of electronics) in an attempt to drive off moisture, it may be more ...

Gold Plated Lead Discoloration
It appears gold (Au) from the leads is diffusing into the solder and forming a solder-gold intermetallic compound (IMC), which ...

Problems with Bubbles in Conformal Coating
It sounds like you're getting poor initial surface wettability between the circuit card and your low VOC silicone compound when ...

When Should We Use Underfill?
Wafer Level Packages (WLPs) should always be plasma treated (in order to improve underfill bonding, fluid flow and adhesion performance), ...

Epoxy Bonding Problems on RoHS Boards
Even if the boards look clean, you should do a Control test to investigate the surface energy of the boards ...

Black Pad Investigation
The black pads are due to nickel corrosion & oxidation during the gold (Au) deposition step. This is a common ...

Delamination dilemma
Delamination, unfortunately, is a fairly common problem for modern circuit boards, especially high-density, multi-layer boards or those composed of advanced ...

Conformal Coating & Humidity
If condensation due to high humidity is penetrating at only the interface(s) of your conformal coating and the board, you ...

Conformal Coating & Humidity
If condensation due to high humidity is penetrating at only the interface(s) of your conformal coating and the board, you ...

Oxidation on Immersion Silver PCB's
To remove oxidation or other contamination from the surface of your Immersion Silver finish, try using a low-pressure gas plasma ...