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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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June 22, 2026 - Updated
December 3, 2025 - Originally Posted
Shielding Techniques When Removing Components Using Hot Air
When removing a component using hot air near heat-sensitive parts, what shielding techniques are most effective?
K.S.
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| Expert Panel Responses |
We use aluminum foil as a shield around the heat sensitive parts in question and we also form the shape to conform around the heat sensitive part to help shield both the hot air as well as heat sinking the heat off the part in question. This approach works extremely well with minimizing heat absorption of the heat sensitive part / device. Also, if one need to understand the temperature rise on the heat sensitive part / device one can tape a thermocouple with Kapton tape to the heat sensitive part / device to understand the actual temperature rise that is being absorbed during the adjacent rework process.
This can be added proof that the heat sensitive part / device is not seeing a temperature rise / absorption that would or could influence long term reliability. We have also made aluminum machined heat shields that can be placed overheat sensitive device / parts that need a large heat sinking capability to protect very heat / temperature sensitive devices / components. Normal rework process shielding can be achieved with just using folded up aluminum foil to create the shape and shield necessary to achieve good results.
Mark McMeen
VP Engineering Services, STI Electronics Inc.
Mark T. McMeen is STI Electronics Inc.ʼs Vice President of Engineering Services. He oversees the daily operations of the Engineering Services division of STI. He has over 18 years experience in the manufacturing and engineering of PCBs.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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