|Ask the Experts|
November 24, 2015
Delamination After V-cut
We have a problem with delamination after breaking our board from a multi-up panel. The material is cem3-V0. The delamination is long the edge of board after breaking at the v-cut before wave soldering.
The depth of v-cut it is within specifications. The v-cut is slightly unbalanced, however when running 2 different models, only 1 model is affected. Do you have a suggestion for the root cause?
|Expert Panel Responses|
I would suggest reviewing IPC-4101D WAM1 Specification for Base Materials for Rigid and Multilayer Printed Boards, for the particulars of the CEM3-VO materials, as there are 5 different types: /12, /14, /16, /35, /81 which all have different Tg.
The need to verify that all the materials behave the same way, one would need to know which of the CEM 3 materials was used. This problem also was seen with FR-4 materials and it was all related to two different FR-4 materials were used by two different fab houses and it wasn't until the laminate was analyzed that the problem was found.
I recommend having a lab check out the laminate material to determine which one was used. Hope this helps and if more is needed please let me know.
Vice President, Technical Director
This is a common issue for the V-cut depanelization process. There are multiple variables in this process to be considered:
Engineering and Operations Management
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