circuitnet
Sponsor
Indium Corporation
Proven Flip-Chip Flux for AI Packages
WS-641 is a proven high-performance flip-chip flux for 2.5D packaging, trusted by leading OSATs to deliver consistent results & reliability in advanced CoW applications.
Indium Corporation
The Economics of Electronic Component Salvage and Reuse
Sponsor
ECD
Need a Profiler Plan B?
Tired of having to share a thermal profiler across different soldering operations? Add the affordable V-M.O.L.E. 2 four-channel profiler to the mix for time-saving efficiency.
ECD
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
July 22, 2015 - Updated
July 15, 2015 - Originally Posted

Tin-lead Component Projections



Can you provide a rough estimate for the percentage of current and future tin-lead finish components that will be required for the aerospace and defense industries? Which is the most promising technology to replace tin-lead in high reliability electronic components used in the aerospace, defense,medical and other market?

A.S.

Expert Panel Responses
It seems that the Aerospace and Defense Industry will continue to use tin-lead processes & components at least until 2019. Last year, members of the Aerospace Industries Association (AIA) gathered to develop a road map for the implementation of a lead-free process for Aerospace & Defense. Since this is just the early stages of the process I'm afraid I cannot make any predictions as far as materials or future technologies. You may access their presentation under the following web page: http://www.aia-aerospace.org/assets/Joint_Government_and_Industry_Executive_Forum_for_Lead_(Pb)-free_Electronics_-.pdf

Edithel Marietti
Edithel Marietti
Senior Manufacturing Engineer, Northrop Grumman
Edithel is a chemical engineer with 20 year experience in manufacturing & process development for electronic contract manufacturers in US as well as some major OEM's. Involved in SMT, Reflow, Wave and other assembly operations entailing conformal coating and robotics.
Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments





Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Master Bond
Thixotropic, Dual Cure Adhesive
Master Bond UV23FLDC-80TK is a dual curing adhesive that withstands rigorous thermal cycling and is suitable for applications where low stress is critical. View full specs.
Master Bond
Reliability is What We Do Best