|
Sponsor
|
|
iX7059 Series by Viscom: Inline X-ray Inspection Power
High-performance Inline X-ray Inspection Systems for complex electronics, semiconductors, and power modules up to 200 kg. Seamless integration, AI-powered accuracy, and maximum reliability for every application.
Viscom
|
|
|
Sponsor
|
|
Repair PCB Damage In-House
Get the tools and materials you need for reliable circuit board repair—from replacement pads and circuit tracks to plated-hole repair kits and epoxies.
Circuit Technology Center
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
May 13, 2014 - Updated
May 13, 2014 - Originally Posted
RoHS Bill of Materials Crosscheck
We are CM for multiple customers. We currently have customers that spec a sn63/37 assembly and will list RoHS compliant BGA's on their Bill of Materials. Is there any service or database that will allow us to take a BOM and determine the max temperature of the components. We usually catch most BGA's and LGA's by looking at datasheets, but recently we've noticed resistor networks and capacitors that cannot see the temperature required for the RoHS reflow profile. It is nearly impossible to pull data sheets for all the components for every build. Any suggestions would be welcome.
N.M.
|
| Expert Panel Responses |
J-STD-609A requires the labeling of component maximumtemperatures. Here�s an example from that standard. You should contact your BGAsupplier re: labeling perJ-STD-609A. The following is an example of 2nd Level Interconnect Component Label indicating a Pb-free e2 material with a maximum component temperature of 260C https://www.circuitnet.com/experts/uploads/1/2nd_level.jpg
Lee Wilmot
Director, EHS, TTM Technologies
Lee Wilmot has 20+ years doing EHS work in the PCB/PCBA industries, including environmental compliance, OSHA compliance, workers compensation, material content declarations, RoHS & REACH compliance. Active on IPC EHS committee and c-chaired committees on IPC-1331, J-STD-609A on labeling & marking, IPC-1758 on packaging and others.
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
Reliability in Automotive Image Sensor Packaging
Image sensors enabling ADAS and autonomous driving must perform reliably over the full vehicle lifespan. Learn how to meet AEC-Q100 requirements and key packaging challenges.
DELO Industrial Adhesives
|
|
|