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Ask the Experts | |||||||
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March 7, 2012 - Updated February 26, 2012 - Originally Posted Variation in Solder Paste ThicknessWe have two openings within one 5 mil laser cut stencil; one with dimension 0.32 x 0.30 and another with dimension 0.27 x 2.05. We notice that the smaller openings tend to have higher solder thickness. Our solder print system has a pressure set at 3 kg and speed of 15 mm/s. How should we go about to improve the thickness so that both openings have similar thickness? A.P. |
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Expert Panel Responses | |||||||
Process Engineer Astronautics Fritz's career in electronics manufacturing has included diverse engineering roles including PWB fabrication, thick film print & fire, SMT and wave/selective solder process engineering, and electronics materials development and marketing. Fritz's educational background is in mechanical engineering with an emphasis on materials science. Design of Experiments (DoE) techniques have been an area of independent study. Fritz has published over a dozen papers at various industry conferences.
Thelikely cause is that the paste is being robbed from the slightly largeraperture / pads. It may sound strange but the best way of overcoming this andmaking the result more even would be to increase the print speed, aim foraround 30 - 70 mm/sec depending on what the paste can cope with. Global Product Champion Henkel Electronics Richard Boyle is a Global Product Champion at Henkel Electronics. He has over 25 years experience in the electronics assembly industry and is responsible for the global technical service of all of Henkel's solder materials.
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