|Ask the Experts|
November 9, 2011
Cleaning Reballed BGA Components
We currently clean reballed BGA components using an ultrasonic cleaner with hot water and cleaning solution. The components are then baked at 100-120 deg c to remove any moisture. The components appear very clean after this process. Is this an acceptable practice for cleaning reballed BGA components?
|Expert Panel Responses|
A defluxing process consists of wash, rinse and drying cycles. In the below explanation, the client mentions that he used hot water and cleaning solution for washing these BGAs, however there is no information on whether they do the rinsing with heated deionized water before components go through the drying cycle. Is rinsing with DI water involved in this process? Visually clean is one thing, however one has to consider the ionic and non-ionic residues as well from electrical cleanliness standpoint. For ionic residues, has the ionic contamination test (ROSE test) or Ion chromatography test been performed on these parts? Additionally, SEM (Scanning Electron Microscope), EDS (Energy Dispersive Spectrometry) or FTIR (Fourier Transform Infrared Spectroscopy) tests could be performed. The components may have to also go through a functional performance test on a populated board to investigate if there would be any issues.
Application Technology Manager
Over the years of selling our reballing mini-oven, we have seen others using ultrasonic cleaners. The one caution is your "cleaning solution." I would do 2 things to be more confident about the quality of your reballed BGA:
This is an acceptable proceedure as long as your baking time meets the requirements of the package that you are reballing.
Regional Sales Manager
OK International Inc.
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