CEM1 Laminate Issues

We use CEM1 laminate. The laminate bubbles and de-laminates during the reflow process. Is CEM1 laminate designed for the higher temperatures of lead free solder? The boards are stored sealed with a desiccant inside the package. We have tried pre-baking the boards for a couple of hours at 100 degrees C, but don't see much improvement. I know this could be cured by changing to FR4, but the cost is a concern. Is there a solution?

A. N.

Expert Panel Responses

CEM1 is a paper-core material laminated with a thin layer of fiberglass. It is not usually able to withstand higher reflow temperatures associated with lead-free solder processing, in fact, it is even problematic for 63/37 solder processing and is typically only used for single-layer PWBs. I sure wish I could provide some good news. If I knew more about the CCA, I could possibly provide you with alternative processing ideas.

Richard D. Stadem
Advanced Engineer/Scientist
General Dynamics

Richard D. Stadem is an advanced engineer/scientist for General Dynamics and is also a consulting engineer for other companies. He has 38 years of engineering experience having worked for Honeywell, ADC, Pemstar (now Benchmark), Analog Technologies, and General Dynamics.

Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address