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Plan Ahead for BGA Device Upgrades
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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October 31, 2011 - Updated
October 31, 2011 - Originally Posted
CEM1 Laminate Issues
We use CEM1 laminate. The laminate bubbles and de-laminates during the reflow process. Is CEM1 laminate designed for the higher temperatures of lead free solder? The boards are stored sealed with a desiccant inside the package. We have tried pre-baking the boards for a couple of hours at 100 degrees C, but don't see much improvement. I know this could be cured by changing to FR4, but the cost is a concern. Is there a solution?
A. N.
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| Expert Panel Responses |
CEM1 is a paper-core material laminated with a thin layer of fiberglass. It is not usually able to withstand higher reflow temperatures associated with lead-free solder processing, in fact, it is even problematic for 63/37 solder processing and is typically only used for single-layer PWBs. I sure wish I could provide some good news. If I knew more about the CCA, I could possibly provide you with alternative processing ideas.
Richard D. Stadem
Advanced Engineer/Scientist, General Dynamics
Richard D. Stadem is an advanced engineer/scientist for General Dynamics and is also a consulting engineer for other companies. He has 38 years of engineering experience having worked for Honeywell, ADC, Pemstar (now Benchmark), Analog Technologies, and General Dynamics.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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