|
Sponsor
|
|
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
|
|
|
Sponsor
|
|
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
|
|
| Ask the Experts |
|
QUESTIONS
SUBMIT
MEMBERS
JOIN
|
August 15, 2011 - Updated
August 15, 2011 - Originally Posted
Stepped Stencil Limit
I've used stencils with 1 and 2 mil steps successfully, but recently I've seen a problem with a 3 mil step (8 mil foil stepped down over most of the printed area to a 5 mil thickness). The problem I'm seeing is that the stencil tends to warp around apertures, particularly in areas like fine pitch QFPs, where there are long apertures close together, and the remaining material is a thin strip. This warp makes the stencil act thicker and allow more paste to be deposited, leading to bridges in the fine pitch QFPs. Is there a rule of thumb regarding the amount of step that can be etched into a stencil? B. B.
|
| Expert Panel Responses |
IPC 7525 recommends 35 to 50 mils keep-out for each 1 mil of step.
Bill Coleman
Vice President Technology, Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
|
|
Submit A Comment
|
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
|
Sponsor
|
|
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
|
|
|