circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
August 15, 2011 - Updated
August 15, 2011 - Originally Posted

Stepped Stencil Limit


I've used stencils with 1 and 2 mil steps successfully, but recently I've seen a problem with a 3 mil step (8 mil foil stepped down over most of the printed area to a 5 mil thickness). The problem I'm seeing is that the stencil tends to warp around apertures, particularly in areas like fine pitch QFPs, where there are long apertures close together, and the remaining material is a thin strip. This warp makes the stencil act thicker and allow more paste to be deposited, leading to bridges in the fine pitch QFPs. Is there a rule of thumb regarding the amount of step that can be etched into a stencil? B. B.

Expert Panel Responses
IPC 7525 recommends 35 to 50 mils keep-out for each 1 mil of step.

Bill Coleman
Bill Coleman
Vice President Technology, Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
Submit A Comment

Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments





Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling