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Smart Sonic
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
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| Ask the Experts |
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August 9, 2011 - Updated
August 9, 2011 - Originally Posted
Minimum Solder Sphere Count Per Pad
For either type-3 or type-4 solder paste, should there be a minimum number of solder sphere deposited on each surface mount pad?
S. S.
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| Expert Panel Responses |
Design guide for stencil aperture size (IPC 7525) is least 5 solder balls across the aperture opening.
Bill Coleman
Vice President Technology, Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
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