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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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| Ask the Experts |
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December 1, 2010 - Updated
November 29, 2010 - Originally Posted
Product Classification - Class I, II or III
Can you point me to any references or documents that can provide very specific guidance for classifying our products? Several of our products could be classified as Class I, II or even III. How do we decide? Can we simply pick one classification and build to it?
I. N.
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| Expert Panel Responses |
IPC-2221 1.6 Classifications of Products
James Mahoney
Applications Project Manager, Quick Turn Flex Circuits LLC
James Mahoney is a Technical Operations Manager with a 20 year track record in managing new product introduction. He is a skilled leader, motivator and problem solver with a strong background in Product Knowledge and Engineering Management.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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