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Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
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Ask the Experts
QUESTIONS
  
MEMBERS
August 11, 2010 - Updated
August 9, 2010 - Originally Posted

Solder Mask Contributing To Solder Balls

Is there any relationship between the shape of the solder mask defined area around surface mount pads and the rate at which we see solder balls? Could increasing or decreasing this area effect solder ball formation?
F. D.
Expert Panel Responses
From my perspective as a chemist, the solder balls form when the surface tension of the solder mask will allow them to form. Also surface roughness may contribute to their formation by means of allowing a crack or crevice to initiate the formation.

Jim Williams
Jim Williams
Chairman, Polyonics, Inc.
Jim Willimas is a PhD Chemist in Polymers and Materials Science. He specialize in printing, cleaning, inks, and coatings used in electronics manufacturng operations. Williams has more than 30 years experience.
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