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Viscosity Does Not Equal Rheology: What Solder Paste Measurements Really Tell You
Viscosity is a useful solder paste quality control measurement, but rheology provides a more complete understanding of how paste will roll, fill, release, recover, and remain stable during stencil printing.
AIM Solder

Ask the Experts

August 11, 2010 - Updated
August 9, 2010 - Originally Posted

Solder Mask Contributing To Solder Balls

Is there any relationship between the shape of the solder mask defined area around surface mount pads and the rate at which we see solder balls? Could increasing or decreasing this area effect solder ball formation?

F. D.

Expert Panel Responses

From my perspective as a chemist, the solder balls form when the surface tension of the solder mask will allow them to form. Also surface roughness may contribute to their formation by means of allowing a crack or crevice to initiate the formation.

Jim Williams
Chairman, Polyonics, Inc.

Jim Willimas is a PhD Chemist in Polymers and Materials Science. He specialize in printing, cleaning, inks, and coatings used in electronics manufacturng operations. Williams has more than 30 years experience.

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Gripping Systems from micro assembly to heavy lifting
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