High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies. Air-Vac Engineering
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Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH
June 9, 2010 - Updated
June 7, 2010 - Originally Posted
Lead to Hole Ratio for Selective Soldering
Does the lead to hole ratio for a selective soldering process vary from a standard wave soldering process? What is the proper lead to hole ratio for selective soldering to achieve good solder flow and proper fillet formation?
F. L.
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Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more Glenbrook Technologies
