Sponsor

Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS

Critical Considerations for Tin Whisker Mitigation

Sponsor

Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect

Ask the Experts

June 9, 2010 - Updated
June 7, 2010 - Originally Posted

Lead to Hole Ratio for Selective Soldering

Does the lead to hole ratio for a selective soldering process vary from a standard wave soldering process? What is the proper lead to hole ratio for selective soldering to achieve good solder flow and proper fillet formation?

F. L.

Expert Panel Responses

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH