circuitnet
Sponsor
SCHUNK
What are your economic depaneling needs?
Our depaneling machines are high-performance machines for single circuit boards with electronic components. The cutting principles are fast, the best quality.
SCHUNK
Introducing New Board-to-Board Connectors
Sponsor
ECD
Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
May 19, 2010 - Updated
May 16, 2010 - Originally Posted

Rules for Reusing Components

What are the rules regarding reusing a component? If you remove a component from a circuit board and the component is functional and not physically damaged, can it be reused on another circuit board?
D. W.
Expert Panel Responses
Reusing components which have been removed from any printed circuit board is risky at best, due to the thermal excursion the component experienced through the assembly cycle and the removal cycle. Although the thermal profile is predetermined during the assembly process it many times is not during the removal and replacement cycle, which could introduce latent failures in the component. The other issue which needs to be addressed and this is an issue we faced many years ago at a computer company, is the product cannot be sold as new equipment, as all the components within the system are not new, some have been removed and reinstalled, so the system has to be sold with the caveat "like new." I know it is a small point but within the limits of the law, it is a point to consider when making the decision to re-use removed components.

Leo Lambert
Leo Lambert
Vice President, Technical Director, EPTAC Corporation
At EPTAC Corporation, Mr. Lambert oversees content of course offerings, IPC Certification programs and provides customers with expert consultation in electronics manufacturing, including RoHS/WEEE and lead free issues. Leo is also the IPC General Chairman for the Assembly/Joining Process Committee.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasma Etch
Contaminant Removal with Plasma
Plasma provides organics removal and other benefits to increase bond strength! Many chamber sizes available, all with a low environmental impact. Learn more.
Plasma Etch
Innovation in Every Drop