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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Ask the Experts

February 22, 2010 - Updated
February 21, 2010 - Originally Posted

Most Difficult Components to Hand Solder

In the spirit of the Olympics, we're looking to devise a contest to challenge our best soldering technicians. Can you suggest some of the most difficult hand soldering applications?

D. N.

Expert Panel Responses

Multi-row connectors with long pins, i.e. PC-104.

Paul J. Koep
Global Product Manager, Alpha

Mr. Koep is responsible for product planning and technical marketing for the Preform Products at Alpha. He is the co-author of several patents in the areas of soldering applications focusing on reflow and alternative methods.

0201 Rework with a soldering iron. 15mil QFP hand soldering.

Edward Zamborsky
Regional Sales Manager, OK International Inc.

Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura