circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
December 9, 2009 - Updated
December 7, 2009 - Originally Posted

SN96 Solderability Issues

We have been hand soldering a connector using 63/37 solder. The connector has bright electrolytic tin as the finish. Recently we switched to SN96 and have been experiencing solderability issues. We sent samples to an independent test lab and had them run solderability testing using both 63/37 and SN96 with RMA flux. The 63/37 samples all passed and the SN96 all failed for de-wetting. As a side note the tin is plated on at 150 micro-inches thick and the connectors are approx. 2 months old. Can you shed any light on this problem?
B. R.
Expert Panel Responses
It is possible that you damaged the plating by operating your soldering stations at too high a soldering temperature. I would suggest evaluating a direct power soldering system operating at a lower tip temperature.

Edward Zamborsky
Edward Zamborsky
Regional Sales Manager, OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling