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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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July 8, 2009 - Updated
July 6, 2009 - Originally Posted
How to predict possible intermetallics
How can we predict the possible intermetallics that will form from two alloys? Would it be a function of temperature?
C. T.
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| Expert Panel Responses |
Growth of intermetallics is a function of the temperature and the time for which the solder is molten - the longer the time the solder is molten, more intermetallics are formed. The composition of the intermetallics is a function of the solder alloy and the substrate metallizations the solder is bonding to.
Karthik Vijay
Technical Manager - Europe, Indium Corp.
Currently with Indium Corporation and responsible for technology programs and technical support for customers in Europe. Over 15 yrs experience in SMT, Power, Thermal & Semiconductor Applications. Masters Degree in Industrial Engg, State University of New York-Binghamton.
The formation of intermetallics depends on the elements in the solder alloy composition, the surface finish of the PCB pads and the finish of the component leads or solder ball composition. The formation of intermetallics also depends on the appropriate soldering temperature and the time the solder remains in a molten state during soldering. The binary or ternary metallurgical equilibrium diagram with the metal elements will show the possible intermetallics and also the composition of the internmetallics.
Brian O'Leary
Global Account Manager, Indium Corporation
Mr. O'Leary is the Global Account Manager for Indium. He has and extensive global network of contacts in the electronics industry with expertise in SMT equipment and processes.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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