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Electrically Insulative, Low Viscosity Epoxy
Master Bond EP3UF is a fast curing adhesive that passes NASA low outgassing requirements and is used for bonding and underfill applications. Discuss with a specialist.
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April 27, 2009 - Updated
April 27, 2009 - Originally Posted
Pick and Place System to Insert Radial Lead Devices
Are there standard SMT Pick and Place Systems that can also insert radial lead devices?
K. A.
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| Expert Panel Responses |
Yes, we at Juki do quite a bit of insertion of radial parts. We have a variety of nozzles, including gripper nozzles, which can be used for insertion of radials or through-hole connectors. Let us know and we'll be happy to look at your application.
Bob Black
North America Sales Manager, Essegi Automation
Mr. Black was the President and Co-Founder of Zevatech in 1977 and introduced first Pick and Place System at Nepcon West 1980. Bob is now the President, CEO and Co-Founder of Juki Automation Systems. He is also a Co-Founder of the SMEMA Council of IPC. He serves as a member of SMTA and SEMI..
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