circuitnet
Sponsor
Air-Vac Engineering
High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering
M804
Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
March 9, 2009 - Updated
March 9, 2009 - Originally Posted

How to bond heavy component to PCB

Can you recommend epoxy to bond a surface mount transformer, 7.5 grams, to a PCB? The board needs to pass 20G vibration and 40G shock tests. What steps do you recommend and in what order should they occur - solder paste, then epoxy, then pick and place, then reflow? Also, how would this process be specified on a drawing, 65% coverage under part, or by volume? Should epoxy pattern under part be dot, striped pattern or solid mass?
C. B.
Expert Panel Responses
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Glenbrook Technologies
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies
REL61