March 4, 2009 - Updated
March 2, 2009 - Originally Posted
Measuring component height after reflow
I have an SMT component that has a height of 8 mm with a stencil thickness of 5mm. We are using lead free solder paste, the pad size is 11"x.054". Is there a method for determining the overall height of the component on the board after reflow?
C.S.
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I would suggest using a VPI-1000 from Easybraid. Once the assembly is reflowed you can simply measure the height.
Edward Zamborsky
Regional Sales Manager, OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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