circuitnet
Sponsor
Ormet TLPS
Highly Thermally & Electrically Conductive TLPS via Filing Paste
New filing highlights advanced sintered metal paste enabling faster installation, superior heat dissipation, higher conductivity, and reliable thermal drain performance without long processing cycles.
Ormet TLPS
Critical Considerations for Tin Whisker Mitigation
Sponsor
Summit Interconnect
Your Domestic PCB Solution
Summit helps you avoid long lead times and added costs—protecting your supply chain without compromise, while delivering the speed and quality you count on.
Summit Interconnect
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
February 2, 2009 - Updated
February 1, 2009 - Originally Posted

High Tg PCB requirement

Do we need to use a High Tg PCB material for a double sided PCB that is 62 mils thick if the PCB will only see one solder reflow step?
D.Q.
Expert Panel Responses
Are you trying to process lead free metal? Do you have small packages on the board. Lifting pads could be of concern if processing at 850 degrees F. I personally prefer to use the higher Tg material in all my designs and have never got in trouble with processing both lead free or good old leaded solder. Take a look at VT-47 Datasheet for Lead Free Assemblies.

James Mahoney
James Mahoney
Applications Project Manager, Quick Turn Flex Circuits LLC
James Mahoney is a Technical Operations Manager with a 20 year track record in managing new product introduction. He is a skilled leader, motivator and problem solver with a strong background in Product Knowledge and Engineering Management.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Oxide Reduction for Reliable Electronics Manufacturing
As power densities increase and components become smaller, oxide layers and surface contamination become critical manufacturing risks. Discover practical approaches for oxide reduction, cleaning and activation in electronics production. Download the whitepaper.
Plasmatreat GmbH
Test & Inspection