High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies. Air-Vac Engineering
Sponsor
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here. Plasmatreat GmbH
November 3, 2008 - Updated
November 2, 2008 - Originally Posted
Lifecycle Standards
I am looking for standards or data on electronic assembly failure rates within a products' lifecycle--such as data that shows where, in an electronic assembly's lifecycle, a product is most likely to fail.
S. A.
Expert Panel Responses
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Sponsor
Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more Glenbrook Technologies
