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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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| Ask the Experts |
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October 20, 2008 - Updated
October 20, 2008 - Originally Posted
Types of Pad Contamination
How many types of pad contamination have been identified to date? For example, I know that there can be phosphorous and chlorine contamination. Can this type of contamination occur while the board is being populated due to fluxes or poor thermal profiles? It seems that the popular opinion is that it primarily takes place during the plating process.
E. F.
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| Expert Panel Responses |
We have found pads with high levels of sulfate, sodium, ammine, rosin, and nitrate besides the chloride and phosphate contamination.
Terry Munson
President/Senior Technical Consultant, Foresite
Mr. Munson, President and Founder of Foresite, has extensive electronics industry experience applying Ion Chromatography analytical techniques to a wide spectrum of manufacturing applications.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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