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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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June 23, 2008 - Updated
June 23, 2008 - Originally Posted
The Importance of Gasketing in Printing Solder Paste
For solder paste printing, how important it is to have gasketing for proper and consistent printing? The term gasketing is used here to describe printing through an aperture that produces a solder pad that is wider than the aperture opening on board contact side.
A.D.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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