Sponsor

High Precision Component Milling
Automatic Removal of Electronic Components including Residual Solder on Heat Sensitive Assemblies.
Air-Vac Engineering

Sponsor

Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH

Ask the Experts

June 23, 2008 - Updated
June 23, 2008 - Originally Posted

The Importance of Gasketing in Printing Solder Paste

For solder paste printing, how important it is to have gasketing for proper and consistent printing? The term gasketing is used here to describe printing through an aperture that produces a solder pad that is wider than the aperture opening on board contact side.

A.D.

Expert Panel Responses

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

Scoring Big With Glenbrook's Real-Time X-Ray Inspection
Jewel Box 70T helps East/West Manufacturing ensure accurate assembly of complex boards, for a system delivering statistics in seconds. Read more
Glenbrook Technologies