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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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March 24, 2008 - Updated
March 24, 2008 - Originally Posted
Inspecting DFN (Dual flat no lead) Packages
What are the requirements and how do we implement inspection process for DFN (Dual Flat No Lead) packages? Can this only be accomplished with x-ray?
P.G.
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| Expert Panel Responses |
Thinking of test from a structural perspective, this is a hidden joint and that makes it a viable candidate for x-ray inspection. X-ray inspection is perfect for hidden joints. That said, a good electrical solution would come with some of the advances in the in-circuit test arena. Agilent specifically has a new iVTEP solution that is less reliant on the leadframe (compared to Testjet/VTEP) to capactively couple to and therefore should be able to provide good opens coverage. Food for thought!
Stacy Kalisz Johnson
Americas Marketing Development Manager, Agilent Technologies
Ms. Johnson's entry into the electronic packaging arena was as a Package Development Engineer. Stacy recently joined the Americas Field Marketing Organization as a Marketing Development Manager for the Americas where she continues to work on AOI, AXI and also In-Circuit Test. NOTE: Ms. Johnson is no longer working at Agilent Technologies.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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