circuitnet
Sponsor
Smart Sonic
440-R + Ultrasonics = Safe & Efficient Cleaning
Clean any type of solder paste in the same machine using 440-R-SMT Detergent. It is the one detergent that will do it all: stencils, pallets, misprints & SMD adhesives.
Smart Sonic
Essential Practices for Gold Mitigation of Electronic Components
Sponsor
Uyemura
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
March 3, 2008 - Updated
March 3, 2008 - Originally Posted

Type IV solder paste on 0201 application

Can I use type IV solder paste on 0201 application? If it can be used, can you explain why it is an acceptable choice?
T. S. Y.
Expert Panel Responses
Type 4 would be the paste of choice for 0201 applications. Rule of thumb is the stencil aperture size should at least 5 times larger than the average paste particle size. For type 4 the average particle size is roughly 30 microns. 5x that is 150 microns. Aperture size for 0201 are typically 200 to 250 microns.

Bill Coleman
Bill Coleman
Vice President Technology, Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Plasmatreat GmbH
Openair-Plasma for Semiconductor Manufacturing
Openair-Plasma for semicon-ductor production is an alternative to vacuum plasma. Typical apps are wire bonding, die bonding & pre-molding. Download here.
Plasmatreat GmbH
Process Assessment Engineer