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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Ask the Experts

March 3, 2008 - Updated
March 3, 2008 - Originally Posted

Type IV solder paste on 0201 application

Can I use type IV solder paste on 0201 application? If it can be used, can you explain why it is an acceptable choice? T. S. Y.

Expert Panel Responses

Type 4 would be the paste of choice for 0201 applications. Rule of thumb is the stencil aperture size should at least 5 times larger than the average paste particle size. For type 4 the average particle size is roughly 30 microns. 5x that is 150 microns. Aperture size for 0201 are typically 200 to 250 microns.

Bill Coleman
Vice President Technology, Photo Stencil

For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura