circuitnet
Sponsor
Circuit Technology Center
Repair PCB Damage In-House
Get the tools and materials you need for reliable circuit board repair—from replacement pads and circuit tracks to plated-hole repair kits and epoxies.
Circuit Technology Center
Five Challenges, Proven Solutions
Sponsor
Essegi Automation
Automated Storage for High-Mix EMS Production
High mix electronics manufacturing requires reliable material management. This white paper explains how BMK enhanced traceability, inventory accuracy and picking efficiency using integrated automated storage, digital workflows and reel-level visibility.
Essegi Automation
Ask the Experts
QUESTIONS
  
SUBMIT
  
MEMBERS
  
JOIN
March 3, 2008 - Updated
March 3, 2008 - Originally Posted

Type IV solder paste on 0201 application

Can I use type IV solder paste on 0201 application? If it can be used, can you explain why it is an acceptable choice?
T. S. Y.
Expert Panel Responses
Type 4 would be the paste of choice for 0201 applications. Rule of thumb is the stencil aperture size should at least 5 times larger than the average paste particle size. For type 4 the average particle size is roughly 30 microns. 5x that is 150 microns. Aperture size for 0201 are typically 200 to 250 microns.

Bill Coleman
Bill Coleman
Vice President Technology, Photo Stencil
For over 18 years, Dr. Coleman has been the vice president of technology for Photo Stencil, working closely with customers to understand their printing requirements. His efforts have resulted in several new stencil products.
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
KYZEN
Maintenance: The Basics of Cleaning Series Part 4
This is the final paper in a series and discusses some of the common mistakes in maintenance cleaning applications found in electronic assembly operations.
KYZEN
 Next Gen Inline 3D X-ray Inspection