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Ask the Experts

February 4, 2008 - Updated
February 3, 2008 - Originally Posted

Voiding after under-fill

During our under-fill process we are noticing voiding after the fact. Is there a tool used to see or test for voiding in an under-fill process?

R.W.

Expert Panel Responses

The primary tool for this activity would be acoustic microscopy. There are primarily two companies in this space: Sonix and Sonoscan. You could also possibly use an infrared camera if the underfill is used for heat dissipation.

Dr. Craig D. Hillman
CEO & Managing Partner, DfR Solutions

Dr. Hillman's specialties include best practices in Design for Reliability, strategies for transitioning to Pb-free, supplier qualification, passive component technology and printed board failure mechanisms.

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