Make sure the solder paste is fresh. Make sure the solder paste has been brought to room temperature before printing. Check the squeegee blade edge to make sure it is not worn. Check the angle of the squeegee blade to make sure it meets specifications. Check the squeegee blade pressure. Clean the bottom of the stencil after each use. Confirm the aperature size is correct on the stencil. Verify the metal content and particle size of the paste is correct.
Edward Zamborsky
Regional Sales Manager, OK International Inc.
Ed Zamborsky is a Regional Sales & Technical Support Manager for Thermaltronics, located in New York. His position requires frequent customer visits throughout North America and the Caribbean and his position encompasses not only sales but the role of trainer and master applications engineer for all of Thermaltronics products. His expertise includes such specialties as hand soldering, convection and conduction reflow techniques, array rework, fluid dispensing equipment, and fume extraction. Ed has authored many articles and has presented many papers on topics such as; Low Volume SMT Assembly, Solder Fume Extraction, SMT Rework, BGA Rework, Lead-Free Hand Soldering, High Thermal Demand Hand Soldering, Lead Free Visual Inspection and Lead Free Array Rework.
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